Technology
From the cold plate on a processor to the dry cooler on the roof, THERMGRID engineers the systems that carry heat out of high-density computing environments.
Approach
Direct-to-chip liquid cooling
Scope
Chip to atmosphere
Systems
4 engineered systems
Overview
Engineered systems
04 systems
How the system works
A simplified direct-to-chip architecture. Actual architectures vary by facility, equipment and system design.
Cooling architectures
A—01
Direct-to-chip
Cold plates capture heat at the processor and carry it out of the rack in a coolant loop.
A—02
Rear-door heat exchange
A coil on the rack door removes heat from exhaust air close to the source.
A—03
Hybrid air + liquid
Liquid serves the hottest components while air handles the rest of the room.
A—04
Facility water integration
Distribution and heat rejection connect the white space to plant and climate.
Conceptual overview — not a recommendation for a specific facility.
Fig. — In-row CDU
Product imagery
Technical capabilities
How technical information is presented across THERMGRID systems — values shown are examples only.
Capabilities overview
Example values
System categories
Liquid cooling, distribution, thermal management, heat rejection
Project types
New build, retrofit, campus programmes, studies
Integration
IT equipment, facility water, BMS / DCIM
Documentation
Schematics, interface schedules, O&M information
Project-specific
Capacity, redundancy and connections defined per project
