System
01
Direct-to-chip liquid cooling captures heat where it is produced and carries it out of the rack in a closed coolant loop.
Category
Engineered system
Scope
Design · integration · commissioning
Content
Illustrative demo
Overview
As processors and accelerators concentrate more heat into less space, air alone becomes harder to rely on. Liquid cooling moves that heat into a coolant at the chip, through cold plates mounted on the processors.
THERMGRID designs the rack-level and room-level infrastructure around that principle: manifolds, couplings, secondary pipework and the interfaces that connect them to distribution.
System components
Cold plates
Machined plates mounted to processors that transfer heat into the coolant through internal channels.
Rack manifolds
Vertical supply and return headers that feed every server in the rack.
Quick-disconnect couplings
Dripless connections that let servers be removed without draining the loop.
Secondary loop pipework
Insulated row and branch pipework between rack manifolds and the CDU.
Leak detection
Sensing at racks and under pipework, integrated with the facility monitoring system.
Where it sits
Engineering considerations
Equipment compatibility
Connection standards, flow requirements and wetted materials are agreed with the IT equipment supplier.
Coolant quality
Filtration, fluid selection and treatment are defined for the life of the loop.
Serviceability
Isolation points and access are planned so racks can be maintained individually.
Phased deployment
Headers are sized and valved so rows can be brought online in stages.
Integration requirements
IT equipment connection standards
Rack layout and row spacing
Overhead or underfloor routing
CDU capacity and redundancy
Monitoring and alarm interfaces
Every integration item is agreed with the project team before design is frozen — so interfaces are defined, not discovered on site.
Fig. 01 — System detail
Fig. 02 — In context
All systems
